Overview

UNICONN Interconnections Technology Co., Ltd. was established in Jan. 2021 by the founder and a group of well experienced engineers in packaging substrate and semiconductor test interface substrates.  UNICONN is committed to producing high-end multi-layer organic substrates (TF-MLO) and advanced packaging substrates (Packaging Substrate). Products are widely used in various end markets, such as HPC (High Performance Computing), Smartphones, IOT (Internet of Things), Automation system and Consumer electronics, etc.