Company Strategy
Uniconntech excels in process management and intelligent systems,
integrating substrate manufacturing technology with semiconductor
application expertise. We provide high-quality, short lead-time, and
cost-effective IC testing and packaging substrates, as well as IC test
circuit board manufacturing and technical services.
With excellent process management and intelligent system feedback, we effectively control idle time and optimize
process connectivity at every stage. From order intake to product delivery, our streamlined approach meets the
high-speed demands of the semiconductor testing industry.
Uniconntech brings together experts in MLO substrate manufacturing, equipment, and semiconductor applications,
integrating substrate process technology to provide customers with reliable quality, short lead times, and cost-effective
services. Our substrate manufacturing capabilities include multilayer stacking, fine-line design, high aspect ratio PTH, electroless/electroplated hard gold surface treatment, and ball drop, creating greater added value for our customers.
About UNICONN
Technology Development
Product Introduction
Quality Management
