Product Introduction
Uniconntech’s products include IC test substrates, IC packaging substrates, IC test printed circuit boards, and panel-level packaging.
IC test substrates, also known as MLO multilayer organic substrates, are used in IC test boards and vertical probe card (VPC) interposer products. IC packaging substrates, also known as ABF substrates, are used in advanced IC packaging, both of which are cutting-edge products in the semiconductor field.
IC test printed circuit boards are widely used in the IC testing industry and have high demand, with a strong emphasis on signal quality.
Uniconntech’s panel-level packaging platform offers the major advantage of low cost without compromising on quality.
Product Introduction:
The main function of IC test substrates (MLO) is to serve as the bridge between the IC and the automatic test equipment (ATE). Compared to IC packaging substrates, MLO substrates focus more on signal and power integrity (SIPI).
Applications:
1. Wafer Testing: Vertical Probe Card
2. Aging Tests
3. Post-Packaging Testing
Features:
1. High Layer Count: 10 to 40 layers
2. Narrow Pitch: 40 to 150 µm
3. Flatness: <25 to 50 µm
4. C4 Pad Durability: 1 million TD ( Touch Down)
Product Introduction:
The IC packaging substrate acts as a bridge between the IC and the PCB, providing electrical connection, mechanical support, heat dissipation, signal integrity, and high-speed signal transmission.
Applications:
1. HPC: CPU, GPU
2. Mobile Devices: Smartphone Application Processors (AP)
3. Automotive: PMIC, ADAS
4. Communication: Wi-Fi, Power Amplifiers (PA)
5. Memory: DRAM, NAND Flash
Features:
1. Circuit: Ultra-fine lines and precision
2. Layer Count: Multilayer and thin
3. Materials: BT, ABF
Product Introduction:
IC test printed circuit boards are essential tools used during the R&D, quality inspection, and production testing phases to assess the functionality, electrical characteristics, reliability, and failure analysis of ICs. These circuit boards play a crucial role in connecting the test equipment with the chips during testing.
Applications:
1. Probe Card
2. Burn-in Board
3. Load Board
4. Functional Test Board
Features:
1. High Precision and High-Density Wiring: Ensures signal integrity and reduces electromagnetic interference (EMI).
2. Low Impedance and High-Speed Transmission: Suitable for high-speed IC testing, such as RF and data communication chips.
3. Special Materials: Utilizes high Tg materials (e.g., FR-4, Rogers) to meet high-temperature testing requirements.
4. Replaceable Test Interface: Allows easy replacement of ICs for testing with different models.
Product Introduction:
Panel-level packaging utilizes substrate platforms to achieve cost-effective fan-out packaging.
Applications:
1. Memory: NAND Flash
2. Power Devices: GaN, SiC
3. Consumer Electronics: Smartphones, Wearable Devices, AR/VR
Features:
1. Low Manufacturing Cost: A single process can package more chips, significantly reducing unit costs.
2. Fewer Process Steps: Supports multi-chip heterogeneous integration, reducing subsequent assembly steps.
3. Excellent Heat Dissipation: The large-area substrate helps with heat distribution and can be paired with embedded thermal structures to enhance reliability.
4. Thin Packaging: Packaging thickness can be further reduced, making it suitable for lightweight and slim devices.
5. High Reliability:Thanks to the stability of materials and the improved heat dissipation performance, the packaging offers excellent reliability.
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