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Core Technology

Uniconntech’s core technologies encompass the Core Layer, Build-Up Layer (BU Layer), Thin Film Layer (TF Layer), and Surface Treatment. Apart from the lower-level core layer, all other processes are self-manufactured in-house. This is in contrast to many competitors who outsource manufacturing to other companies, which can lead to issues like communication delays and unclear accountability between multiple suppliers.

Uniconntech’s integrated manufacturing, quality control, and after-sales services provide customers with a more streamlined communication channel, allowing us to respond to customer needs more quickly and efficiently.

Circuit Manufacturing Process

MassLam、HDI、Board Bonding

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