Technology R&D
IC Substrate
With the rapid development of applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, IC packaging substrates (IC Substrates) are advancing toward higher density, higher frequency, lower power consumption, and heterogeneous integration. The technological advancements in IC substrates not only drive the development of the semiconductor industry but also provide more reliable solutions for high-performance computing and high-speed communication. Below are Uniconntech’s future development directions in IC substrate technology:
1.Glass Core Substrate
Glass substrates, with their superior surface flatness, lower coefficient of thermal expansion (CTE), and finer line width/spacing (L/S < 2μm), have become the ideal choice for AI and HPC chip packaging. Their high stability and fine wiring capabilities help enhance signal integrity and reduce power consumption, meeting the demands of high-frequency applications. Additionally, the low CTE of glass substrates reduces thermal stress between the package and substrate, improving overall packaging reliability and lifespan.
2.Heterogeneous Integration, HI
Heterogeneous integration technology, using organic interposers combined with silicon bridges (Si-bridge), enhances computational performance and power efficiency by integrating multiple chiplets. This packaging method allows chips with different processes and functions to be combined in a single package, not only reducing costs but also providing ultra-high bandwidth I/O solutions to support faster signal transmission. Since heterogeneous integration boosts chip performance and flexibility, it will play an increasingly important role in HPC, AI processors, and networking communication applications in the future.
3.Fan-out Panel Level Packaging, FOPLP
Fan-out packaging, utilizing substrate and printed circuit board (PCB) platforms, reduces substrate thickness or eliminates the substrate altogether to enhance signal transmission efficiency. This technology not only lowers equipment and material costs but also improves electrical performance and thermal management through finer wiring structures. Compared to traditional packaging technologies, FOPLP increases the packaging area utilization, allowing more I/O to be accommodated in a smaller package size, thus further enhancing system integration and performance.
4.Fine Line/Space, L/S
Currently, the mass production technology for advanced substrates has reached L/S 8/8μm. In the future, the goal is to challenge L/S 5/5μm or even finer line width/spacing to support higher frequency signal transmission requirements. Through finer circuit designs, signal integrity can be enhanced while transmission loss is reduced, enabling substrates to meet the demands of next-generation high-speed computing and communication technologies. Additionally, improvements in fine line/space are crucial for increasing packaging density and reducing power consumption. As technological breakthroughs occur, they will likely drive the development of ultra-high-density packaging.
Future Outlook
With the continuous growth in market demand, Uniconntech will continue to invest in research and innovation to drive more efficient and reliable IC substrate technology, addressing the challenges and opportunities of the future electronics industry. In addition to technological innovation, future development must also focus on advancements in material technology and improvements in manufacturing processes to ensure high-quality and highly reliable substrates. By continuously optimizing production processes and enhancing manufacturing capabilities, the IC substrate industry will be able to meet increasingly stringent technical requirements, bringing broader applications and greater value to the semiconductor industry.
About UNICONN
Technology Development
Product Introduction
Quality Management
